NI Hongjiang, SONG Kechun, LI Jun, et al. Preparation and high temperature load-carrying performance of polyimide composites with embedded defects[J]. Acta Materiae Compositae Sinica, 2025, 42(10): 5680-5689. DOI: 10.13801/j.cnki.fhclxb.20250208.001
Citation: NI Hongjiang, SONG Kechun, LI Jun, et al. Preparation and high temperature load-carrying performance of polyimide composites with embedded defects[J]. Acta Materiae Compositae Sinica, 2025, 42(10): 5680-5689. DOI: 10.13801/j.cnki.fhclxb.20250208.001

Preparation and high temperature load-carrying performance of polyimide composites with embedded defects

  • Polyimide composites with embedded defects were successfully prepared by inclusion-embedding method with autoclave molding. By testing and simulation, the influence of defects was investigated on the static strength and fatigue performance of the equal-thickness open-small-hole typical part and the varied-thickness open-large-hole typical part at a high temperature. The high temperature static and fatigue residual strengths of the equal-thickness open-small-hole typical part remain above 92% when a Z=60 mm (Z represents half of the sum of the long axis and short axis dimensions of the defect) defect is embedded. There is no explicit influence of a Z=125 mm defect on the fatigue residual strength of the varied-thickness open-large-hole typical part at high temperature. The load-carrying capacity of this composite is more sensitive to the defects near its edge. This study may provide a basis for evaluating the defect allowance and optimizing the internal quality inspection standard for polyimide composites.
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