硅氧烷齐聚物颗粒增强Sn-Ag基复合钎料的熔化特性

Welding characterization of polyhedral oligomeric silsesquioxane particles reinforced Sn-Ag based composite solder

  • 摘要: 具有纳米结构的有机-无机笼型硅氧烷齐聚物(POSS)作为强化相的POSS/Sn-3.5Ag复合钎料可有效地改善基体钎料钎焊接头的力学可靠性。在前期试验的基础上,采用差热分析试验的方法分析了POSS 质量分数为3%的POSS/Sn-Ag复合钎料中POSS颗粒的熔化特性。结果表明,3% POSS/Sn-Ag复合钎料的熔化温度与Sn-3.5Ag共晶钎料相近,POSS颗粒的加入对其熔化温度影响不大,说明复合钎料在熔化特性上可以满足工艺性能的要求。此外,差热分析计算表明,3% POSS/Sn-Ag复合钎料在冷却过程中具有更高的表观活化能值,说明POSS强化相可能主要存在于Sn晶粒的晶界处。

     

    Abstract: Nano-sized polyhedral oligomeric silsesquioxane-TriSilanol cyclohexyl (POSS) particulates reinforced Sn-3.5Ag composite solder joint could improve mechanical reliability. The 3% fraction of POSS reinforcement is the best weight fraction. The welding characterization of POSS reinforcement in 3% POSS/Sn-Ag composite solder was analyzed through differential scanning calorimeter (DSC) analysis based on former experimental results in this paper. Results indicate that the welding temperature of 3% POSS/Sn-Ag composite solder is similar to that of Sn-3.5Ag eutectic solder, so 3% POSS/Sn-Ag composite solder has acceptable processing property. In addition, according to DSC analysis, 3% POSS/Sn-Ag composite solder has higher activation energy. It demonstrates that POSS reinforcements might be present in the Sn boundaries.

     

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