耐高温、低导热、韧性中空陶瓷微珠复合材料的制备及其性能

Preparation and performance of hollow ceramic microsphere composites with high-temperature resistance, low thermal conductivity and toughness

  • 摘要: 在高速飞行的过程中飞行器温度急速上升,飞行器舱段间的密封材料不仅要具有优异的耐高温性能,同时要具有较低的导热系数辅助参与阻隔舱段间的热量传递,并且要具有优异的力学性能使其不被破坏。以中空陶瓷微球为骨料,加入酚醛树脂及磷酸盐固化体系制备有机/无机杂化耐高温韧性复合材料,并对复合材料进行高温处理,研究复合材料在高温处理前后的变化。通过力学性能测试、SEM观察以及XRD和FT-IR测试对复合材料高温处理前后的抗压强度、压缩形变能力、微观结构以及组分变化进行表征,并通过火焰燃烧对复合材料耐高温性能进行测试。结果表明,所制备的复合材料具有较高的抗压强度以及优异的韧性,1000℃高温处理600 s复合材料的宏观形貌未受到影响,具有较高的热稳定性。导热系数测试结果表明,中空陶瓷微珠含量的增加、酚醛树脂的添加以及高温处理均会导致复合材料导热系数降低,最低的导热系数低至0.16 W/(m·K)。

     

    Abstract: In the process of high-speed flight, the temperature of the aircraft rises rapidly. The sealing material between the aircraft cabin should not only have excellent high-temperature resistance, but also have a low thermal conductivity to assist in blocking the heat transfer between the cabin, and have excellent mechanical properties to prevent it from being damaged. Used hollow ceramic microspheres as aggregates, added phenolic resin and phosphate curing system to prepare organic/inorganic hybrid high-temperature resistant and tough composites. The composites were subjected to high-temperature treatment to study the changes of the composites before and after the high-temperature treatment. The compressive strength, compression deformation ability, microstructure and composition changes of the composites before and after the high-temperature treatment were characterized by mechanical performance test, SEM observation, XRD and FT-IR. In addition, the high-temperature resistance performance of the composites was tested by flame combustion. The overall results show that the prepared composites have high compressive strength and excellent toughness. The macro morphology of the composites is not affected by the high-temperature treatment at 1000℃ for 600 s, which indicates that the composites have high thermal stability. And the thermal conductivity test results show that the increase in the content of hollow ceramic microbeads, the addition of phenolic resin and the high-temperature treatment all cause the thermal conductivity to decrease, and the lowest thermal conductivity is as low as 0.16 W/(m·K).

     

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